Used ESEC 2007 BGA #9219697 for sale

ESEC 2007 BGA (Ball Grid Array) is a type of die attacher that is designed to facilitate efficient and accurate die assembly for a range of printed circuit board designs. As the name suggests, 2007 BGA is designed for use with ball grid array technology, allowing it to rapidly attach and solder an array of small solder balls to a printed circuit board. ESEC 2007 BGA is capable of performing die and substrate attachment, soldering, and electrical testing processes, all of which are necessary components of modern PCB assembly. 2007 BGA equipment is composed of three main components: an adjustable vacuum table, an adjustable jig, and an infrared heating system. The adjustable vacuum table is designed to hold the substrate securely while the adjustable jig is used to accurately control the position of the solder balls during the attachment process. The adjustable jig can be adjusted for different sizes of solder balls and different hole sizes on the board to ensure that the right number of solder balls are applied. The infrared heating unit is then used to accurately heat the substrate and ball grid array assembly, allowing for a reliable and secure joint. ESEC 2007 BGA is designed to offer a range of features that allow it to perform a wide variety of PCB assembly tasks. Its jig machine maintains a high degree of accuracy and precision, limiting the amount of adjustment time needed to match board requirements. It also offers a "Quick Pick" feature to reduce the time of substrate changeover, which is essential for high-volume production. The heating tool also utilizes a quick-clean facility and "In-Line" heating mechanism to speed up the soldering process. 2007 BGA is designed with safety in mind and is certified for use in industrial environments. It has features such as dual chamber cleaning, an ESD-protective circuit, and numerous sensor points to ensure the quality and reliability of the PCB assembly process. The asset also has an advanced network model and remote management tool which allow users to view equipment status remotely, giving users the ability to monitor and adjust the system as needed. In summary, ESEC 2007 BGA is an advanced, precision-based die and substrate attacher that is designed to provide a fast, accurate, and reliable means of creating and attaching ball grid arrays to printed circuit boards. It offers numerous advantages, such as accuracy, speed, safety, and remote management. These features make 2007 BGA an excellent choice for modern PCB assembly applications.