Used ESEC 2007 BGA #9312621 for sale

ESEC 2007 BGA is an automated die attacher that is used to attach die to substrates or packages. 2007 BGA is a reliable and cost-effective solution for die attachment, especially for large scale production runs of printed circuit boards and semiconductor packages. It features an advanced computer-controlled equipment, allowing for precise alignment and attachment of the die. ESEC 2007 BGA features an air-controlled die-to-substrate attachment process, and offers very precise and repeatable placement of flip chip, wirebond, or SOIC devices. It comes equipped with a fixtured arm and adjustable air pressure settings that allow for variable die alignment depending on the substrate type. This makes it possible to accurately place of the die, thereby reducing rejection and stemming the need for rework. 2007 BGA also features a vision system for alignment, which is used to accurately position the die within the substrate or package prior to attachment. The vision unit uses two cameras to simultaneously capture a top-down view of the die and substrate, ensuring the maximum accuracy in placement. The vision machine also utilizes advanced software algorithms to detect misalignment and ensure precise placement results. ESEC 2007 BGA is also easy to use and maintain. It is designed with a user-friendly interface and intuitive touch-screen operation. This makes setup, operation, and maintenance of the tool easy, even for first-time users. The asset also features a self-diagnostics model that helps identify faults and alert the user to any potential issues. Overall, 2007 BGA is a reliable and cost-effective solution for automated die attachment and is suitable for large-scale production runs. Its precise alignment and vision equipment minimize rejection and rework, while the user-friendly interface makes operating and maintaining the system easy.