Used ESEC 2007 HS Plus #293794226 for sale

ESEC 2007 HS Plus is a state-of-the-art high-speed wire clinch die attacher that is designed to accurately and quickly attach dies to substrates. The die attach process begins with a die-carrying tape that gets placed on a shuttle tray. With the tray in place, 2007 HS Plus is configured to perform the die attach process in one of two ways: Hotbar and Thermal Induction. In both processes, the heated die is dispensed onto the edge connector. Afterwards, the die is secured by applying force in the form of a piece of metal, namely a wire. The wire is applied to the metal edge connector with enough force to create a mechanical bond, thus creating a secure die attachment. The Hotbar process uses a heated tool to create a die attach by pressing the metal edge connector onto the die. The Thermal Induction process uses a heated tool in conjunction with a magnetic force to induce a bond between the metal edge connector and the die. ESEC 2007 HS Plus ensures a secure die attach with a variety of features built into the design. For example, it features an advance joystick control, a high-accuracy bidirectional servomotor and an automatic tool change mechanism, which help it to accurately and quickly place the die attach wire to the exact desired location. The machine also contains a range of safety features, such as a recall function and error detection capability, to ensure the safety of employees and the accuracy of the die attaches. In addition, 2007 HS Plus is capable of attaching dies upside down, reducing any chance of damage from shock or defective parts handling. It is fast and efficient, with a die attach cycle time of only 0.3 second. Furthermore, it is relatively intuitive to use and offers a touchscreen interface for easy setup. Overall, ESEC 2007 HS Plus is an ideal die attacher for industrial and consumer electronic applications. It is fast, reliable, and accurate, and offers superior safety and ease of use compared to traditional die attach methods.