Used ESEC 2007 HS Plus #9097174 for sale

ESEC 2007 HS Plus (High Speed Plus) die attacher is a high-performance, automated die attaching machine. It is designed to quickly and accurately apply adhesive and wire-bonds to the leads of a semiconductor device such as an integrated circuit, transistors, and diodes. This machine provides both process accuracy and repeatability that is suitable for a wide range of die attach applications. 2007 HS Plus is composed of two main parts: the base platform and the head section. The base platform is a stable platform which holds ESEC 2007 HS Plus in place during operation. It is comprised of a metal frame, an adjustable base, and a vacuum cup mounted beneath the frame to securely hold the substrate. The head section is where all the electrical, mechanical, and optical components are located. It consists of a servo-driven XY positioning equipment with trapezoidal tracking and a rotating head. This system allows the die attacher to precisely move and attach the substrate leads in a single- or multi-point operation. 2007 HS Plus also includes a vision unit that is used to monitor multi-point operation and provide real-time adjustment of the position of the substrate leads. The vision machine has a CCD-based image capture and color analysis capabilities, which allow it to accurately verify and detect differences between substrate leads. This feature helps to ensure that the die attach process is repeatable and reliable. ESEC 2007 HS Plus also provides several other features such as automatic lead length detection, pass/fail analysis of die attach modes, temperature-controlled epoxy curing, as well as process control features including cycle times and feed rates. All of these features make 2007 HS Plus an ideal choice for automating the die attach process. Overall, ESEC 2007 HS Plus provides a cost-effective, high-speed die attaching solution. Its high degree of accuracy, repeatability, and process control capabilities make it well-suited for manufacturing substrates for a wide range of applications. Additionally, its vision tool and parameter-adjustment capabilities allow it to provide fast, reliable, and consistent results.