Used ESEC 2007 HS #9108988 for sale

ESEC 2007 HS is an automated die attacher designed for high-speed attachment of multiple dies to substrates and IC packages. This tool is capable of mounting dies at the speed and accuracy required in high-volume production. 2007 HS has a variety of features that make it a reliable and versatile die-attachment solution. ESEC 2007 HS offers a number of different die-attachment processes, including drag attach, die-bond, and inertia attach. The machine's die-feeder equipment is capable of accommodating wafers of different sizes while allowing interfacing with both manual and automatic resources. The manual resources include the manual die-loading system for single dies and the tape loading for tape die loading. Additionally, an automated die feeder offers automatic die loading and sorting capabilities. 2007 HS also offers a range of vision systems to ensure accurate die placement. This includes a 1D or 2D barcode reader, a high-resolution machine vision unit, and a Low Vision Kit (LVK) for detecting and measuring small wires and pads on the die substrate. This does not require the use of a microscope. ESEC 2007 HS also features an advanced die recognition machine that can identify die edges and apply an appropriate pattern to accommodate different dies. This allows for secure, reliable die attachment. Additionally, its die match feature ensures a reliable die-to-die bond by measuring and validating die characteristics. Finally, 2007 HS features intelligent process control software and built-in intelligence allowing the machine to provide in situ decision-making and allow for fast, reliable, and quality die attachment. Additionally, the intuitive user interface makes it easy to adjust parameters and control the attachment process. Overall, ESEC 2007 HS is an automated die-attachment solution that provides fast, reliable, and quality die attachment as well as a number of features that make it a versatile and reliable option for high-volume die-attachment needs. With its intuitive design, reliable processes, and intelligent process control, 2007 HS is a great choice for die-attachment needs.