Used ESEC 2007 SSI Plus #9299380 for sale
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ESEC 2007 SSI Plus is an electronic die attacher that offers superior performance and reliability. This revolutionary unit is a reliable and rugged solution for die attachment most commonly used for die bonding and burnishing applications. The equipment is designed to provide high efficiency and a great return on investment. 2007 SSI Plus is manufactured using a rigid steel frame which ensures stability and precise positioning of the die attach head and is built to withstand heavy vibration. The double-acting air cylinder enlarges the die using a servo motor, as well as holding the die securely in place. The die attach head is constructed of high-grade aluminum and incorporates an aluminum straight jet nozzle which is designed to optimize attachment time while ensuring a reliable bond. ESEC 2007 SSI Plus also features a touchscreen LCD control panel with intuitively designed graphical user interface, making the system easy to use and navigate. An LED light enables easy monitoring of the machine during operation and provides visual prompts for maintenance diagnostics. The unit also provides advanced control and monitoring options for easy troubleshooting. The built-in web server offers remote access to the machine controls, giving operators the ability to monitor and manage the machine from anywhere in the world. The machine includes an Ethernet connection so that data can be transferred to and from a remote computer. 2007 SSI Plus is designed to reduce costs by optimizing cycle times and reducing waste. The unit is designed to keep die in perfect alignment and therefore minimize discontinuities in the process. In addition, with advanced temperature control and die trimming capabilities, this unit is the perfect solution for a variety of die attach applications. ESEC 2007 SSI Plus is an excellent choice for die bonding and burnishing applications and is designed to provide superior performance and reliability. Its advanced control features and flexible options make it an attractive solution for any die attach application.
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