Used ESEC 2007 SSI Plus #9299384 for sale

ESEC 2007 SSI Plus is a semi-automatic die attach machine specifically designed for flip chip, wafer bumping, and other advanced packaging techniques. This machine uses a servo-driven XY-table to precisely align and place dies onto the substrate, thus providing high accuracy of die placement with a repeatability of ±5 microns. Furthermore, the custom flexibility of 2007 SSI Plus allows the user to attach anything from small chips (less than 2mm) to large uBGA packages (up to 50mm) with a wide variety of adhesives and die attach materials. ESEC 2007 SSI Plus is equipped with a vision equipment to ensure the accuracy of die placement. This system is able to detect and inspect the position of components, with a pixel resolution of 5.1 microns. The vision unit is able to detect die aberrations and inaccuracies in placement, which can be corrected quickly before they become a major issue during production. This machine also features a 'real-time feedback' machine which communicates the entire process of die attach from placement to curing. This feature helps the user to track the progress and makes corrections ahead of time, thus eliminating the chances of erroneous production runs. 2007 SSI Plus is capable of speeds up to 400 die per hour, with a maximum acceleration of 10G and a programmable servo drive speed of up to 0.500 M/sec^2. This die attach machine is even designed for advanced packaging techniques, including flip chip technology. The built-in die picking tool allows the user to quickly and accurately place flip chips onto the substrate. The adjustable height of the placement arm makes it possible to accommodate different sizes and shapes of dies, such as 03015 and 11020 designs. This machine also offers a high-resolution image of the chip prior to placement. ESEC 2007 SSI Plus is a reliable, precise, and affordable semi-automatic die attach machine, which provides the necessary flexibility and control to make a wide variety of packaging techniques possible. With its unique features and capabilities, it is an ideal solution for intricate die attach requirements that require the most accuracy and repeatability.