Used ESEC 2007 SSI Plus #9396941 for sale

Manufacturer
ESEC
Model
2007 SSI Plus
ID: 9396941
Soft solder die bonder.
ESEC 2007 SSI Plus is a fully automated die attacher that offers innovative solutions for die bonding applications. It is a self-sufficient, stand-alone equipment that is capable of handling a variety of dies. It is equipped with the necessary hardware and software interfaces to achieve full Q-Matrix application production. Designed for ease of operation and maintenance, 2007 SSI Plus can quickly and reliably perform a wide range of die bonding tasks with its patented input/output (I/O) system. The I/O unit features adjustable laser power levels, auto-sensing functions, and a film holder that eliminates tedious film handling procedures. These features enable the machine to perform a variety of demanding die bonding tasks with maximum efficiency and accuracy. ESEC 2007 SSI Plus features a self-leveling "best fit" capability, which means that even if the die is slightly misaligned, the tool can still bond it accurately and reliably. This is done by adjusting the laser power, spot energy, and spot size in order to heat the die more uniformly. Additionally, the asset can bond multiple dies both stacked and staggered, regardless of their size, allowing it to handle a wide variety of jobs. In terms of safety, 2007 SSI Plus features a built-in, laser divergence controller that significantly reduces the risk of laser damage to the die surface. The model also includes a modem-integrated safety equipment, allowing it to be monitored remotely by maintenance technicians. Finally, the system has a visual inspection unit included, which allows operators to quickly, and accurately, inspect the die after completion of the bonding process. Overall, ESEC 2007 SSI Plus is a robust and reliable machine that offers innovative die bonding solutions. With its patented I/O tool, self-leveling capability, laser divergence control, and modem-integrated safety asset, 2007 SSI Plus delivers exceptional quality and accuracy with every die bonding job. This makes it a reliable, and cost-efficient die attaching solution for any production environment.
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