Used ESEC 2007 SSI #9112328 for sale

ESEC 2007 SSI is an automated die attacher process that is used in the manufacture of semiconductor packages. It is designed to provide a reliable and consistent process for attaching die to various substrates, such as leadframes and wafers. 2007 SSI comprises of several components, including a control unit for controlling the die attachment process and a die attach arm for providing the means of connecting and pressing the die onto the substrate. This die attach arm is made up of a robot arm with a die holder, vacuum nozzle and a work table. The die is then placed onto the work table and the arm is moved to the desired position. The equipment is then operated using the control unit. This unit is responsible for providing the system with the necessary commands for controlling the die attach arm, coordinating the die attach cycle and the die handling operations. It also has the ability to detect whether die position has been raised and lowered correctly, as well as monitor the die temperature. The control unit also features a user interface which allows the user to enter parameters such as the size of die, the substrate material and the gap between the die and the substrate. These parameters will then be used to control the process and help ensure that optimum die attachment is achieved. ESEC 2007 SSI also features several safety features, such as an indicator light to show when the die is being attached and when the unit is in process. The machine also has a series of warning systems that are activated in the event of a process error occurring. In addition to providing the necessary control and safety features, 2007 SSI is also designed to be highly efficient. It is capable of operating at a speed of up to 4 die per second, which is twice the speed of a manual die attach tool. This increased speed helps to reduce process time, resulting in improved productivity and cost savings. Overall, ESEC 2007 SSI is an automated die attacher process that is designed to provide an efficient and accurate method for attaching die to different substrates. Its range of control and safety features, as well as its increased speed, make it an invaluable tool in the production of semiconductor packages.