Used ESEC 2007 SSI #9202919 for sale
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ID: 9202919
Wafer Size: 6"-8"
Die bonder, 6"-8"
Wafer map capability without barcode reader
Adjustable rack: XY-Shuttle manual adjustable
Magazine handler: 2MH2
Reel to reel handling
Strip input:
Stack power
TOS Stack
Temperature control: (8) Zones upto 450°, ±5°C
Die size: 1.0 x 1.0 mm - 11 x 11 mm / 40 x 40 mils - 430 x 430 mils
Die placement accuracy: ± 80 µm / 1°
Lead frame:
Width: 30 mm.
ESEC 2007 SSI, often touted as the "gold standard" in die attachers, is a fully automated, long-view die bonder. Built to be an efficient, precise, and reliable solution to die attachment, 2007 SSI comes with an array of features enabled for optimal performance. The core of ESEC 2007 SSI is its built-in dispensing equipment. This system has been designed to dispense without fail, filling each part of the die with its exact requirement of epoxy or adhesive. It's also equipped with a proprietary camera unit that can accurately identify the size, shape, and intricate details of any die, even those significantly larger than average. 2007 SSI's advanced imaging and dispensing features are complemented by its peak accuracy and repeatability during the actuating and pre-alignment process. Equipped with three high-precision actuators, the unit is able to align and pick-and-place die accurately regardless of the material or environment the die is in. The X-Y axis alignment is a particular standout, capable of submicron variations. ESEC 2007 SSI also features an advanced heating machine, engineered to allow the machine to work at the exact temperature required of the die bonder. This provides for good die adherence and high-quality results. The tool also has an integrated asset for monitoring die temperature. Finally, 2007 SSI stands out in its ultra-low emissions and waste product. This reduces both air pollution and the need for manual waste and recycling management, making it a preferred choice for green-minded customers. In summary, ESEC 2007 SSI is one of the most reliable and highest performing die bonders on the market today. Its advanced features and environmental benefits make it a great choice for many applications.
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