Used ESEC 2007 SSI #9234948 for sale

ESEC 2007 SSI
Manufacturer
ESEC
Model
2007 SSI
ID: 9234948
Vintage: 1999
Soft solder die bonder TO220 FPDT 1999 vintage.
ESEC 2007 SSI is an advanced electromagnetic stirrer for die attaching applications, widely used in the semiconductor industry. It offers easy operation, superior accuracy, and an adjustable stirring speed of up to 7500 RPM. 2007 SSI is capable of accurately attaching a variety of different types of dies, allowing more flexibility in product design. ESEC 2007 SSI features a unique rotary-style chuck which is designed to securely hold die attachments. This chuck can be fixed or changed without the need for additional tools, allowing for quick and easy operation. The precise motion of the chuck is achieved through a stepper-type motor which operates with minimal power consumption and a highly accurate rotary encoder which ensures precise control over the chuck's position. The die attachment procedure is controlled by a PLC computer through a series of switches, allowing for greater control over the whole process. 2007 SSI also features a powerful stirring reservoir which is designed to smoothly expel and mix the die attachment material. This allows for uniform and repeatable results, thus reducing product waste. The stirrer also features precision regulating valves which allow for the adjustment of the material's flow rate and concentration, allowing for greater control over the die attachment process. Overall, ESEC 2007 SSI is an advanced system designed to handle complex die attaching tasks quickly and accurately. Its precise stepper motor, adjustable speed settings, adjustable flow rate and concentration, and highly precise rotary encoder provide superior accuracy and control, making it an ideal choice for semiconductor fabrication applications.
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