Used ESEC 2007 SSI #9234957 for sale

ESEC 2007 SSI is a fully automated die attacher. It is designed to increase production yields for semiconductor and electronic industries. This equipment accurately and efficiently attaches dies onto the lead frames. It is highly modular and customizable, allowing for flexibility in product design and engineering. The system is composed of several components, each optimized for their particular purpose in the die attach process. First, is a lead frame transfer arm assembly, responsible for transporting and positioning lead frames. Second, is a die transfer arm assembly, equipped with hollow aluminum shafts that hold the dies securely. Third, is the die attach wagon, housing up to two die attach heads. Finally, there is the die attach head, which are specifically designed to align and attach the dies onto the lead frame. 2007 SSI operates in four distinct steps. First, an operator manually inserts lead frames into the machine. The lead frame transfer arm is responsible for transporting the lead frame to the die attach wagon. Then, the die transfer arm removes and places each die onto the lead frame. Third, the die attach head automatically dips and deposits conducting adhesive on the die to ensure secure attachment to the lead frame. Finally, the lead frame transfer arm places the completed lead frames onto the pallet strips. The entire unit is controlled by a proPROG PLC controller, allowing for quick and accurate machine operations. It features a 10.1-inch touch panel display, along with intuitive human-machine interface. The tool also includes peripheral components such as palletizing stations and learning towers, to quickly and accurately calibrate the die attach processes. Overall, ESEC 2007 SSI is a robust and reliable die attacher, well-suited for semiconductor and electronic industries. Its accurate and efficient operations provide high-quality products, while facilitating production yields and reducing the total cycle time.