Used ESEC 2007 SSI #9315303 for sale

ESEC 2007 SSI is a die attacher designed specifically for semiconductor and electrical component packaging. It is a single-station die attacher that is suitable for manual or automated die placement of surface-mount components. It is equipped with a die-attaching station, manual control station, and automated control equipment. The die-attaching station is composed of a vacuum cup, center feed mechanism, hot melt adhesive dispenser, and die-sensing device. The vacuum cup's suction power allows for precise and accurate die-positioning in each cycle. The center feed mechanism features a patented magnetic flux control system that ensures uniform die-positioning and an even distribution of the hot melt adhesive. The hot melt adhesive dispenser is capable of automatically dispensing the correct amount of adhesive and can be adjusted for each die to ensure proper adhesion. The die-sensing device is equipped with a vision unit and LEDs which allows for precise die placement, even across multiple layers. The manual control station is equipped with a programmable operating machine with a user-friendly graphic interface. This tool can be programmed with up to 25 die geometries and up to 1000 die placements. The automation asset is designed to facilitate a smooth and efficient transition from manual to automated die placement. It features a single-mask PLC controller and can be fully customized to the customer's needs. The model also allows for integration with a substrate handling equipment. 2007 SSI is a robust and reliable die attacher designed for use in the demanding semiconductor industry. Its precision die- positioning, hot melt adhesive solution, and automated control system make it a highly efficient die-attaching unit. It is ideal for high-volume die placement applications and can be used for both manual and automated die attachment of various types of semiconductor components.