Used ESEC 2007 SSI #9315304 for sale
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ID: 9315304
Soft solder die bonders
DPAK TO251 Standard
Wafer ID scanner
Input handler
Stack power / Power lead frame loader
Soft Solder Dispenser (SSD)
Soft solder indexer
BH Maximum adhesive head rotation angle: 270°
Automatic calibration angle: 5°
Stepping UPH: 3,500 Per hour.
ESEC 2007 SSI is a semi-automatic die attacher for permanent attachment of lead frames to stamped or die-cast housings or other substrates. This self-contained unit is designed to accepts both lead frames and housings and can be used with a variety of substrates, from small parts to larger outframes with multiple contacts. The die attacher features a self-contained optical imaging equipment. This offers optimal placement of the lead frames without the need of external equipment, resulting in accurate and consistent attachment. The system also offers automated alignment of the lead frames via piezo actuators. This provides improved accuracy along with minimizing operator damages. Additionally, the die attacher can identify the orientation of specific lead frames from its unique U-shaped contact. This ensures that the final attachment of the lead frame is consistently in the correct orientation. 2007 SSI die attacher is equipped with an integrated controller that allows for both manual and automated operation. The user interface allows for programable parameters such as cycle time, lead frame position, and pressure setting. This ensures process repeatability and consistency for the lead frame attachment process. The die attacher unit is directly mounted to the customer's process equipment. This can be done via various interfaces including vacuum orpcb-based connection. This helps reduce costs and improve machine throughput from the customer's equipment. ESEC 2007 SSI is equipped with an ultrasonic welder for bonding thin wires. This provides an additional attachment for delicate substrates and also results in significant cost savings. The welder also offers an improved signal integrity compared to traditional soldering processes. 2007 SSI die attacher is also designed with safety measures in mind. These include a built-in safety interlock in order to ensure operator safety, as well as fire suppression capabilities and advanced protection measures for the unit components. Overall, ESEC 2007 SSI die attacher is a semi-automatic machine designed for attaching lead frames to housings across a wide variety of substrates. It offers accurate, repeatable attachment with minimal operator intervention. The tool also offers an integrated ultrasonic welder and safety measures, making it ideal for the efficient lead frame attachment.
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