Used ESEC 2007 SSI #9371976 for sale

ESEC 2007 SSI is a die attacher, a type of tool used in semiconductor manufacturing processes. It is ideal for use in assembly lines of integrated circuit (IC) manufacturing, and it is designed to provide accurate, reliable results. 2007 SSI is equipped with a vertically and horizontally adjustable floating slide. It allows for the secure holding and alignment of dies during the bonding process. The unit also features an adjustable reel and a tensioning mechanism, ensuring that dies are held tightly while still providing maximum adhesive performance. ESEC 2007 SSI is capable of accurately applying eutectic, lead-free or silver-epoxy die attachments. A high-precision release device ensures that die bonding occurs in a reproducible manner. Its high degree of accuracy and repeatability makes it ideal for production lines and other large-scale production situations. 2007 SSI is built with an advanced temperature control system, allowing for accurate dieattach temperatures from room temperature up to 250°C. This helps ensure reliable, consistent bonding results. Additionally, the unit's integrated machine intelligence can detect and alert users of possible faults to ensure the highest level of die attach quality. ESEC 2007 SSI has various safety features, including an enclosed cabinet structure, safety guards and emergency stop switches. It also features a user-friendly touch panel for easy operation. In summary, 2007 SSI is a high-precision die attacher designed for use in IC manufacturing. It features adjustable slide and tensioning mechanisms, reproducible dieattach, advanced temperature control and safety features. These features ensure that dies are securely bonded with maximum adhesive performance, making ESEC 2007 SSI an invaluable tool for any IC production line.