Used ESEC 2007 #293622820 for sale

ESEC 2007 is an automated die attach equipment from Assembleon that is designed to increase production and increase yields in the manufacturing process. The system is capable of processing components at up to 12,000 CPH and can attach components as small as 0201. The unit integrates with both pick and place systems and SMT, PTH and wave soldering systems to create an all-in-one production line. 2007 machine consists of two main components - a feeding tool and an adhesive dispenser. The feeding asset utilizes a vibratory bowl to separate and feed components onto the pick-up area of the model. Once on the pick-up area the components are sorted, quantified and ready to move on to the adhesive dispenser. The adhesive dispenser is designed to accurately dispense the exact amount of adhesive onto each component as required. Once the adhesive has been dispensed, the components are placed onto the substrate for final attachment. This process is repeated until the entire substrate is loaded with components. ESEC 2007 also includes a software package allowing users to control, monitor and adjust the equipment parameters remotely. This includes dispensing rate, accuracy and first pass yield monitoring. To help ensure quality and increase production, the system also includes a vision inspection unit to verify positions of components. The machine also includes a variety of alert and warning features to help the user identify problems or issues in the production line. In conclusion, 2007 tool is an advanced die attach asset designed to increase production and yields in an automated manufacturing environment. It integrates with existing systems to create an all-in-one production line, with a variety of control and monitoring features to help ensure consistently high quality products.