Used ESEC 2007 #9161385 for sale

ESEC 2007 is a die attacher designed for use during semiconductor encapsulation processes. It is designed to facilitate the attachment of leadframes to a variety of different substrates, such as leadframes, IC chips, and soldered terminals. It is constructed from durable ceramic or steel components for long-term reliability, and features a variety of adjustable settings for optimal accuracy. The device operates by using a die bonding platform that is capable of precision alignment of leadframes and other substrates onto a larger backing material. In order to achieve this level of accuracy and repeatability, a highly sensitive optical equipment is used to detect misalignments of as little as 0.1 millimeters. This system utilizes a CCD or CMOS camera to capture images of the substrate before it is attached. The unit is also capable of recognizing differences in substrate surface area, ensuring that the dies are securely attached. 2007 is also designed to minimize displacement of dies by using a vacuum-assisted loading machine that pulls the dies securely onto the backing material. This ensures that the dies remain in the correct position during the entire process and eliminates the need for manual re-positioning. Additionally, a temperature-controlled gasket tool prevents warping of the dies due to thermal expansion. For increased safety, the device is powered by a low voltage DC motor and features redundant power supplies for additional reliability. It also features a built-in safety interlock asset that prevents operation if any of the components become disconnected or jammed. This model also ensures that the process is stopped immediately in the event of an equipment failure. In addition to the default settings, the device can also be programmed to meet the specific requirements of the user. ESEC 2007 is compatible with a wide variety of other semiconductor production tools, providing a comprehensive solution for integrated package assembly. This equipment is ideal for the automotive, medical, and consumer applications.