Used ESEC 2007 #9239343 for sale

ESEC 2007 is a high-volume die attacher and flip chip bonder equipment designed to increase production throughput and reduce cost of ownership for high-volume semiconductor packaging. Developed by ESEC Corporation, the system is optimized for wire bonding, substrate and optical packaging applications. 2007 features a higher speed die bonder interface for high uni-axial and multi-axial die attachment with minimum bond distortion. It is designed with an integrated Hydraulic Control Unit and a Thermal Compensator to ensure consistent and accurate operation in different environmental conditions. The unit is capable of bonding speeds of up to 20kCPM (kiloCycle Per Minute) and can cycle every 0.8 seconds. It has a wide range of die attach programs for a variety of chip sizes and variable modes of operation including manual, semi-automatic or fully automated settings. The machine is also equipped with an Electro-static Discharge (ESD) protection tool for safe wire bonding operations. Its innovative Smart Sensor technology ensures highly accurate and repeatable adhesive application to maintain assembly accuracy. It also has an intuitive software interface that allows operators to quickly and easily program and control the asset. Additionally, it is equipped with advanced fault detection and self-diagnostic features that enable the model to detect and diagnose any problems quickly and accurately. The equipment is designed for quick and easy integration into existing production lines. It comes pre-loaded with the latest production software, allowing for greater operational flexibility. Additionally, the system is designed with a modular design and can be easily reconfigured to accommodate changes in production requirements. ESEC 2007 High Volume Die Attachment and Flip-Chip Bonding unit offers manufacturers a reliable, flexible and cost-effective method to increase production throughput in high-volume semiconductor packaging operations. The machine's innovative features and cutting-edge technology make it an ideal choice for a wide variety of packages.