Used ESEC 2007 #9239345 for sale

ESEC 2007 is a state-of-the-art die attacher that can help to automate intricate and precise operations in the semiconductor industry. This machine is especially useful for the assembly and bonding of extremely tight package designs used in high-end devices. 2007 offers an automated die-thinning process, with three different kinds of dies available: one for flip chips, one for die and one for bare die. The machine utilizes pressure and vacuum to accurately attach the dies onto a substrate. The pressure can range from 10 to 120 PSI, allowing for a precise amount of force to be used when bonding the die. The machine also includes an LED display panel that provides information on how the machine is being operated. This helps the user to quickly identify any problems and make the appropriate corrections. The original design of ESEC 2007 included a self-compensation feature. This feature allows the machine to lower the applied pressure when a die is not properly placed on the substrate. This helps to prevent damage and allows for greater accuracy when mounting delicate electronic components to a substrate. The bed of 2007 is designed with a non-skid surface. This prevents the die from becoming misaligned during the attachment process. Additionally, the machine is equipped with a lid and an air filter that are designed to keep dust and debris from entering the machine. ESEC 2007 is a fully automated die attacher that is reliable and easy to use. Its various features and components offer a variety of mounting solutions for users in the semiconductor industry. The machine is capable of providing high-quality connections that are capable of handling tight package designs. Furthermore, the cost of the machine is much more affordable than many other die attachers on the market.