Used ESEC 2007 #9243299 for sale

ESEC 2007
Manufacturer
ESEC
Model
2007
ID: 9243299
Die bonder For D-PAK.
ESEC 2007 is a die attacher that uses a vacuum technique to securely place a die onto a substrate. This system is used in various industries including automotive, aerospace, mobile phones, and semiconductor. The die attaches to the surface of the substrate with the help of a vacuum, securing it in place with no adhesive needed. 2007 is a user-friendly unit that is highly precise and easy to operate. ESEC 2007 utilizes a pneumatic vacuum hold-down station that is combined with a soldering tool. This combination is used to attach the die in place and then keep it there until the system is turned off. The die can be easily removed when the system is turned off and does not require any additional adhesive to keep it secured. 2007 has two vacuum chambers that are used simultaneously when attaching the die. The first chamber helps to secure the die to the substrate while the other chamber is used to firmly secure it in place. The vacuum chambers ensure the die is perfectly secure without leaving any traces of adhesive residue. Once the die is secured, the soldering tool is used to make sure the wire bonds and connections are secured. This helps to eliminate the possibility of any additional materials being required between the die and substrate. ESEC 2007 is designed to provide reliable die placement for many different types of substrates including organic substrates and rigid boards. In addition to being highly reliable, 2007 comes with an easy to use graphical user interface. This makes it easy to set up and use in a multitude of industries. It is CE certified and has been tested to assure durability and reliability. ESEC 2007 also has a service technician available to assist with any technical questions or problems that may arise. 2007 die attacher is a versatile and easy to use unit that can fit within a wide variety of industrial settings and applications. Its vacuum technique makes it an efficient and reliable choice for attaching die to substrates with no adhesive residue. As a result, ESEC 2007 is a reliable and cost-effective solution for die attachment.
There are no reviews yet