Used ESEC 2007 #9243303 for sale

ESEC 2007 is a die attacher, which is a specialised type of industrial equipment designed to be used in the manufacturing of semiconductors and other electronic components. It is a highly efficient and powerful tool that is capable of achieving accurate and precise results when attaching a range of different dies to a substrate. 2007 is used in the manufacture of integrated circuits, disposable electronics, and medical applications. ESEC 2007 die attacher uses stiff, spring-like fingers to hold the die in place while a strong adhesive is applied to the substrate. An automated mandrel equipment is used to accurately position the die, providing a repeatable attachment process. The mandrel is connected to a motor-controlled actuator that applies pressure and keeps the die in alignment with the substrate and contact pads. The actuator can be adjusted to different settings to accommodate varying die sizes and substrates. 2007 die attacher features a built-in quality assurance system which includes high-resolution optical cameras and detection sensors. This unit can detect any minor defects in the die, substrate, or adhesive application. ESEC 2007 can also be set up with a production tracking software which provides traceability of production steps and allows for quality measurements to be taken at any point in the production process. 2007 is designed with a robust construction in order to provide long-term use and reliability. It utilises stainless steel components which provide corrosion resistance, as well as dirt and dust protection. The heavy-duty motor is equipped with an innovative cooling machine, to provide long-term performance and reduced energy consumption. Overall, ESEC 2007 die attacher is a reliable, efficient and precise tool for the manufacturing of high-quality semiconductor and electronic components. Its rugged design and built-in quality assurance features provide a reliable and repeatable attachment process, enabling operators to produce components with high accuracy and increased yields.