Used ESEC 2008 HL #179475 for sale

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Manufacturer
ESEC
Model
2008 HL
ID: 179475
Die bonder DINP, WMP, FPD, LMU.
ESEC 2008 HL is a high-quality, full-feature die attacher that is designed to be used in a variety of industrial and commercial applications. The machine is equipped with a tie-rod controller that allows the user to precisely adjust the pressure of the die and an adjustable alignment equipment for easy and accurate placement. The die is held in place with a special clamping system that does not allow the die to move, ensuring consistent results. 2008 HL has an adjustable arm for changing die attachment angles and an adjustable die head. This makes it easy to adjust to any height, allowing the operator to work quickly and efficiently. The die head also features a rapid change unit that makes it easy to switch between various die attachments. The arm can be moved up and down, allowing the operator to accommodate various sizes and shapes of dies. ESEC 2008 HL also has a built-in bond strength monitoring machine, allowing the user to adjust the die pressure to achieve optimal bond strength. A built-in tension gauge makes it easy to assess the tension during assembly. 2008 HL die attacher is a reliable and efficient attacher that is perfect for a variety of applications, including electronics assembly, wire bonding and plastics extrusion. Its ergonomic design and durable construction make it an ideal choice for any industrial or commercial situation. Its combination of features and user-friendly design make it the perfect choice for any application that requires precise and reliable die attachment.
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