Used ESEC 2008 HL #9329199 for sale

ESEC 2008 HL die attacher is an advanced automated die bonder and wire bonder designed for high speed assembly of packages in the microelectronics and electronics industries. The machine is capable of achieving high yields even in the most technically challenging High Lead Pitch applications. 2008 HL die attacher is a low cost, high performance wire bonder with a compact footprint that allows it to fit in most production lines. It is designed to work with a range of wire sizes from 21 ga to 18 ga and can bond up to 200 wires per minute. The machine will bond up to six or eight die per second with a maximum of 148 die attached in a single run. ESEC 2008 HL's advanced software is designed to be easy to use and can support a range of programming parameters and sequencing steps. It is designed with a large linear motion X-Y drive system to assure precise and repeatable die placement on the substrate. 2008 HL is equipped with a wide variety of tooling, such as bevel shears, rotating-target die bonders, bond breakers, and special die and wire bond tools. It comes with advanced features such as a vacuum clamp and anti-vibration clamps for accurate and repeatable die placements, and a spray-cooling system to maintain bond integrity and stability. ESEC 2008 HL also offers an advanced array of sensors that can detect shear force, strain, and potential damage during the bonding process. It also has a high-resolution camera which can be used for visual examination of the die as part of the inspection process. 2008 HL die attacher is a reliable, high performance machine that is designed to meet the most challenging requirements of today's microelectronic and electronic industries. It is equipped with advanced features that provide the highest yields in the most demanding high lead pitch applications. ESEC 2008 HL is an invaluable tool for high speed assembly of microelectronic packages.