Used ESEC 2008 HS III Plus #9119676 for sale

ESEC 2008 HS III Plus
Manufacturer
ESEC
Model
2008 HS III Plus
ID: 9119676
Die bonder.
ESEC 2008 HS III Plus is a high-speed die attacher with advanced features for industrial applications. It offers high-precision speed stability and accurate attachment of high precision semiconductor dies onto substrates. 2008 HS III Plus is part of ESEC long and successful history of providing precision high-speed die attachers. ESEC 2008 HS III Plus has a unique design, with an ultra-efficient pick-and-place mechanism. It uses a proprietary electromagnetic actuation technology, which provides a controlled and precise motion for attachment of die on substrates. This ensures that each die is accurately placed in its predetermined location, and the connections are securely bonded. 2008 HS III Plus also utilizes precision aiming technology to correct for die placement inaccuracies as well as separate detections techniques to determine when a die has been successfully attached. The high-speed capability and accuracy of the machine are increased by the use of multiple cameras for accurate die centering. In addition to its demanding speed and accuracy, ESEC 2008 HS III Plus is also designed for efficient operation with features such as an adjustable speed range, a programmable workspace, and a user-friendly graphical user interface. The machine is also suitable for integration into existing production systems, and includes robot ready programming technology for easy communication and integration with other machines. This allows for the attachment of a wide range of different devices and substrates. 2008 HS III Plus also includes a number of safety features to ensure that production runs smoothly and safely. This includes a low-voltage safety system to prevent electrical shock, as well as pressure sensitive sensor systems and emergency stop buttons. ESEC 2008 HS III Plus is designed for use in a variety of industrial applications, from consumer electronic devices to automotive parts. It is also suitable for use in the medical industry, and is compatible with a range of standard die types. 2008 HS III Plus is an advanced and reliable high-speed die attacher that offers high-precision speed stability and accurate attachment of die on substrates. With its user-friendly graphical user interface, adjustable speed range, robot ready programming, and safety features, this machine provides the perfect solution for a broad range of industries.
There are no reviews yet