Used ESEC 2008 HS Plus #293634047 for sale

Manufacturer
ESEC
Model
2008 HS Plus
ID: 293634047
Die bonder.
ESEC 2008 HS Plus is a high-speed, fully automated die attacher that has been designed with reliability and efficiency in mind. The die attacher is capable of accurately attaching die on a variety of substrates, from rigid boards to flexible materials. This versatile machine is capable of packaging microelectronic components and delicate ceramic components, thanks to its ability to be set up for use with either a conventional or vacuum equipment. For maximum flexibility and efficiency, ESEC 2008HS PLUS comes with 8 pick-up heads, each 30mm wide and allowing for an angle of up to 15 degrees, making it easy to navigate around complex shapes. The vacuum system ensures that there is no material loss or damage to the die, while the high speed unit increases the speed of die attachment. 2008 HS Plus is designed to make the process of die-attaching simpler and quicker than ever, with a user-friendly interface that allows for simple point-and-click operation. By plugging in die-tooling cartridges that can accommodate a range of die substrates, users can switch between applications quickly and easily, reducing downtime and costs. The reinforced aluminum arms are lightweight, ensuring that they can be set to the desired height quickly, while the ballscrews allow for incremental adjustments to be made. The inside of the die attacher features top-of-the-line components, such as a 1.15Kw rotary drive motor and a 1000Wt stitch-weld motor, which are both encased in a sealed aluminum housing to protect against dust and other environmental contaminants. Overall, 2008HS PLUS is a reliable, efficient, and user-friendly die-attaching machine that can increase production rates and reduce downtime. With its ability to attach die to a variety of substrates, as well as its powerful components and easy-to-use operation, ESEC 2008 HS Plus is ideal for anyone who needs to perform die-attaching quickly and accurately.
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