Used ESEC 2008 HS Plus #293747548 for sale

ESEC 2008 HS Plus is an advanced die attacher designed to quickly and accurately attach die to different circuit boards for a variety of applications. This highly versatile machine is compatible with all major SMT production machines and reliably produces high-quality connections each time. The HS Plus features two nozzles and two heads, making it possible to attach two diaphragm die simultaneously to a single substrate with a single pass. The nozzles are adjustable to accommodate different substrate thicknesses and angles, providing consistent and repeatable distance between the die and substrate. The top nozzles can be adjusted for minimum gap, minimum displacement, and height accuracy in accordance with the die and substrate specifications. The HS Plus is equipped with several innovative design features to ensure optimal performance. This includes audible and visible alarms for any potential mechanical or electrical dies and a temperature monitor for precise operation. It also has a digital display with easy-to-use touchscreen navigation for ease of use. Furthermore, an attached heat exchanger cools the air during operation, providing an even temperature and higher accuracy. The HS Plus is equipped with a pressure sensor that detect if there is any misalignment between the die and the substrate, as well as a real-time camera that records the die attaching process. This allows for accurate diagnostic and troubleshooting if necessary. Additionally, the HS Plus is equipped with a robot nozzle system for accurate nozzle positioning and system calibration. ESEC 2008HS PLUS is a reliable and high-precision die attacher that provides a quick, accurate, and reproducible solution for attaching die to different substrates. Its adjustable nozzles, real-time camera, and other innovative features make it a great choice for any SMT production line.