Used ESEC 2008 HS Plus #9360712 for sale

ESEC 2008 HS Plus is an advanced die attacher designed to provide users with quick, precise and stress-free attaching workflows. This equipment is an adhesive-free bonding solution for microelectronic packages and components, including the attaching of copper strips, soldering, and die assembly. ESEC 2008HS PLUS is a fully automated all-in-one solution for die attaching applications. It ensures reliable and repeatable results by bringing accuracy and bandwidth to the process. The tool positions and adjusts dies and chips accurately into place using a combination of precision motors, robust sensors, and intelligent motion controls. An intuitive graphical user interface (GUI) enables quick and easy calibration of die positions for optimal performance. The system supports various die materials, sizes and shapes, and can even be used for multi-die packages. The HS Plus features a stable and robust fixture unit, offering superior results and repeatability. Thanks to ESEC unique rigid beam technology, the die positions are kept in place without the use of adhesives. The attacher will automatically start the attaching process when the die is positioned correctly, and thanks to the advanced die profile optimization, users can expect excellent attaching performance even in small and difficult to reach dies. 2008 HS Plus provides users with an out of the box solution for their die attaching needs. With its integrated microcontroller and multiple heads, the machine has the capability to process a large number of die workloads at high speed. The solution also includes a PC-based software platform, allowing users to monitor and manage the tool's operations remotely. Overall, 2008HS PLUS is an affordable and safe solution, offering users precision die attaching with agility, repeatability, and reliability.