Used ESEC 2008 HS #293627981 for sale

ESEC 2008 HS is a high-performance die attacher designed especially for high density memory chips. This automated machine is capable of attaching up to 8 million dies per hour. 2008 HS has been designed to guarantee high throughput and consistent die placement, which makes it one of the most reliable and accurate die attachers in the market. ESEC 2008 HS is equipped with a vision equipment that enables precise placement of the dies. It uses a camera and a precision mounted fluid nozzle to place the dies accurately in the required location. This ensures a consistent and fast throughput. The vision system can also be used to verify the positioning of the dies after placement. 2008 HS is also equipped with a high speed loader and a high speed picker. The high speed picker is capable of picking up even the most demanding dies from the feeders. The high speed loader allows for efficient and accurate loading of dies which significantly reduces cycle time and cost. ESEC 2008 HS also uses a sophisticated chip handling unit. This machine is capable of accurately plotting the die placement coordinates and the pick-and-place locations. With the help of this tool, 2008 HS can quickly and accurately place the dies on the lead frames in the appropriate positions. ESEC 2008 HS is also designed to handle complex geometry and other more challenging die designs. This allows the machine to work with newer and advanced memory technologies. It also allows the user to rapidly adjust the die placement parameters to provide precise and precise die placement. Overall, 2008 HS is one of the most reliable and accurate die attachers in the market today. It offers a high throughput, increased accuracy and improved flexibility. This makes it an ideal solution for applications involving high density memory chips.