Used ESEC 2008 HS #293629353 for sale

ESEC 2008 HS is an automated die attacher for attaching dies to insulating carriers for insulated metal substrates. This machine is capable of handling a wide variety of die types and sizes, from 0.21mm (8 mil) to 0.55 mm (22 mil). It can attach up to 48 dies per hour, using a high speed vacuum pick and place equipment. 2008 HS die attacher consists of three main components: a control system, a vacuum pick and placement platform and a dieloader. The control unit allows for setup and editing of dieattaching routines, monitoring and compensating for substrate movement, tray detection and more. The vacuum pick and placement platform provides a precisely-controlled, high speed, accurate method of attaching the dies onto carrier frames. The dieloader machine is a straightforward, reliable and efficient device that is capable of handling various sizes and types of dies. ESEC 2008 HS die attacher utilizes a 3-axis positioning tool, enabling precise die placement on both sides of the substrate. The precise positioning helps to ensure that the dies are properly aligned and securely attached to the substrate. The machine is operated by manipulating the controls available on the control panel or with the software provided. The process begins by loading a set of dies into the die loader and setting the appropriate parameters in the control asset. The vacuum pick and placement platform then transports a die to the precise location on the substrate. Once the die is placed, a strong air blast is used to secure it in place. 2008 HS die attacher is a precise, reliable and efficient device that can help improve production yields and reduce costs. With its ease of use, accurate die placement and efficient operation, it is an excellent choice for any application requiring quick, reliable die attachment.