Used ESEC 2008 HS #9155977 for sale

ESEC 2008 HS is an automated die attach equipment designed to improve the productivity and accuracy of die attach processes in the production and assembly of semiconductor devices. This system offers a range of features to simplify the handling of dies, a tool-less approach to attaching the dies, and improved accuracy of the die placement. 2008 HS can handle a range of die sizes, from 80 um to 400 um. The unit uses a suction cup to pick the die from a feeder or cassette, and it is then transferred to the dispensing point within the machine. This transfer is precise and accurate, minimizing the risk of damage to the die during the process. The die is then touched to the appropriate substrate before being placed accurately on the substrate using the dispensing gun, which is powered by a vacuum. ESEC 2008 HS also offers a range of features to help simplify the die attaching process, including automatic stoppage of the process if there is a fault or misalignment, and the ability to display images of the die on a monitor to assist with the placement. The tool also has optical alignment capability to ensure the accurate placement of the die. 2008 HS die attacher provides greater flexibility with its range of features, improving the die attach process and increasing productivity. This asset is ideal for the production and assembly of semiconductor devices, and offers a faster, more accurate, and more reliable way to process dies.