Used ESEC 2008 HS #9222414 for sale

ESEC 2008 HS die attacher is an automatic machine designed for depositing solder paste onto various substrates. It is capable of attaching solder paste to chip components, substrates, heat sinks, stiffeners, and other electronic assemblies. The machine features a stage for auto-aligning the component during the process, as well as an optional axial force adjustment equipment. 2008 HS is composed of various parts such as a die attach table, an auto alignment stage, and an option for axialforce adjustment. The die attach table is a stationary platform made of stainless steel that provides a stable surface for the positioning of components. It has four adjustable guides that ensure precise alignment. The auto alignment stage is designed to accurately position the components onto the die attach table at a precise angle. Its surface is made of hardened stainless steel and also offers four adjustable guides. The optional axial force adjustment system is designed to provide accurate placement of the solder paste on the component. The unit allows for precise control of the axial force applied to the component, providing a consistent solder paste pattern on the component. ESEC 2008 HS is equipped with a number of features that ensure it can handle a wide range of components and substrates. It can handle components made of various materials such as aluminum, copper, tin, and ceramics. The die attach table can handle substrates up to 16mm thick, and it is equipped with several additional features such as an optical laser pointer, a microprocessor based control, and an integrated vacuum machine. 2008 HS is also designed for maximum user convenience and safety. It has a user-friendly control panel with a LCD display and an ergonomically designed handle for easy operation. It also has an emergency stop button and safety sensors to provide an extra level of protection. ESEC 2008 HS is a robust and reliable die attacher that is ideally suited for a wide range of component attachment applications. Its ease of use and excellent features make it an ideal solution for many industrial and consumer electronic assembly processes.