Used ESEC 2008 HS #9266262 for sale

Manufacturer
ESEC
Model
2008 HS
ID: 9266262
Wafer Size: 12"
Vintage: 2004
Die bonder, 12" Type: D161 2004 vintage.
ESEC 2008 HS is a high speed die attacher which is designed to be used in high-end electronics manufacturing. It is a robust, reliable and cost-effective die attach solution. 2008 HS is a vertical die attacher which uses a jetting technology with an XY equipment for precise die placement. The XY system allows for a precise alignment and dispense accuracy of 0.01mm for shallow ejection forces and temperature. The unit has a high-speed vision alignment machine to ensure accurate placement and comes with a high-resolution camera for real-time vision monitor. The tool is highly versatile and can work with a variety of die sizes, from 0.5mm to 16mm. It also has precise placement accuracy of 0.003mm to 0.01mm. ESEC 2008 HS is capable of bonding both new and reuse dies, which makes it ideal for mixed-technology applications. The asset has a compact design that makes it easy to integrate into plants and workspaces. Its high-speed driving capabilities also make it very suitable for production line operations, increasing overall productivity and efficiency. 2008 HS comes equipped with a range of parameters and settings that can be adjusted to cater to specific applications. It has temperature control capabilities, allowing for precise temperature management during bonding and easy adjustment of die attachments. With its fast adjustment and pickup times, the model ensures fast and accurate die attach operations. ESEC 2008 HS is suitable for both SMD and CSP die attach. Its simple design and user-friendly interface make it suitable for use by technicians of all levels. Also, the accessible maintenance equipment and simple parts replacement makes it easier and quicker to adjust and maintain the system. Overall, 2008 HS is an excellent die attacher which is well-suited for high-end electronics manufacturing operations. It has a robust, reliable and cost-effective design that is capable of precise die placement and temperature control. With its user-friendly interface, adjustable parameters and fast operation, it is a great choice for manufacturers.
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