Used ESEC 2008 HS #9360756 for sale

ESEC 2008 HS die attacher is a state-of-the-art die bonding machine primarily used in the semiconductor industry. This machine is designed to attach integrated circuits (ICs) onto a solid substrate for a variety of uses. It features an innovative clamping equipment to ensure that the correct balance and pressure is supplied to each IC die during bonding. Additionally, the machine is equipped with a large, interchangeable platform that allows for various die sizes to be attached quickly and efficiently. 2008 HS die attacher is composed of several components working together to ensure accurate attachment of the die onto the substrate. It includes a hopper, a stepper motor, an X-Y platform, an LCD for editing parameters, an automated clamping assembly and an automated release system. The hopper is designed to continuously feed the IC dies into the machine, allowing for high-speed operation. The high-precision stepper motor is responsible for positioning the X-Y platform, and the LCD allows users to customize the parameters of the attachment process. The automated clamping assembly applies the appropriate pressure to the die to ensure the bond is secure and the automated release unit ensures the die is released at the desired time. On the software side, ESEC 2008 HS die attacher also includes software specifically designed to appropriately configure the machine for different die sizes. This software helps to simplify the setup process, allowing for quicker setup and more efficient manufacturing. With a compressed air machine, the machine is also able to effectively remove defect die from the substrate surface, ensuring that only the high quality die remain and further streamlining the entire attachment process. In conclusion, 2008 HS is a highly advanced die attacher that offers fast and accurate attachment of IC dies to substrates. With its quick setup time and specialized software, it is an ideal solution for semiconductor manufacturers looking for a reliable and efficient way to attach die to substrates quickly and accurately.