Used ESEC 2008 HS #9360766 for sale

ESEC 2008 HS (high speed) is a die attacher designed for use in the die/package attach process. It is an electrostatic device used to apply die to a substrate such as a leadframe, ceramic, printed circuit board, or other flat surface. It works by generating a static charge in the air between the two surfaces that are to be bonded. This static force causes a small amount of die to be pulled towards the substrate, forming a bond. 2008 HS is a highly automated and efficient device, capable of performing die/package attach processes at greater speeds than traditional brazing or soldering methods. It has a number of advantages over these older methods, such as being able to bond a wider range of material types together, having greater repeatability and stability with respect to bond strength and repeatability, and lower capital and maintenance costs. ESEC 2008 HS features a self-contained system that allows for quick die changeover times and offers clear access to the die storage cassettes. It has a modular construction that allows for expansion and customization, and can accommodate up to four die storage cassettes at once. The system also features a die ring positioning mechanism that allows for precise placement of the die on the substrates being processed. 2008 HS is designed for maximum reliability and ease of use. It has a user-friendly control system and a variety of visual and audio alarms to alert the operator when any signals are detected that may require attention. ESEC 2008 HS can also easily be integrated into existing production lines while still offering the latest in die attach technology. Overall, 2008 HS is a highly efficient and reliable die attacher that can provide faster turnaround times, higher quality bonds, lower costs and greater repeatability than older methods. It is an ideal choice for die bonding operations in a variety of industries, where fast turnaround, greater precision, and greater reliability are all desirable.