Used ESEC 2008 HS #9360779 for sale

ESEC 2008 HS
Manufacturer
ESEC
Model
2008 HS
ID: 9360779
Vintage: 2006
Die bonder 2006 vintage.
ESEC 2008 HS is a high-speed, automated die attacher suitable for product line attachment. It is designed for accurate, fast and reliable attachment of dies on to electronic assemblies. It is capable of attaching with precision onto various formats of substrates, including FR-4, polyimide, aluminum, kapton, mylar, and others. 2008 HS utilizes magnetic pulsed force technology to quickly attach the dies, significantly reducing the time and effort required for manual die attachment. In addition, the unit features a patented "hands-free" die-attach sequence, allowing operators to work quickly and efficiently. The die attacher is a free-standing unit that can be easily mounted onto a production floor. ESEC 2008 HS can attach to components as quickly as one second per die in a single-shot operation and offers several advantages over traditional die attach processes. These advantages include an improved traceability due to the unit being self-tracking, limited thermal stress and no part contact. It can also be connected to a factory data system, allowing for improved management control. 2008 HS utilizes a die-as-needed (DAN) method of operation. This allows for greater accuracy in die placement as the unit "trims" each die before attachment. This allows for precise die placements even when working with sensitive substrates. It also features an integrated self-test algorithm and advanced calibration methods to ensure that the unit is producing quality parts. ESEC 2008 HS also offers an intuitive user interface for ease of use. The unit's modular design allows for future upgrading and reconfiguration in an easy-to-use manner. In addition, the unit has an input capacity of up to four different die platforms and can accommodate settings for quick pick-and-place and auto pick-and-place operations. 2008 HS is designed to work well with various production cycles and can operate usefully between temperatures of 15°C - 70°C. In addition, the unit is equipped with a wide variety of accessories, such as manual die feeders, auto feeders, and automatic die counter. The unit's modular design allows for future upgradability without compromising its performance or dependability. ESEC 2008 HS provides an ideal solution for high-speed, automated die attach production and can be used to produce superior electronic assemblies with greater reliability and accuracy. The unit's accuracy, speed, and dependability make it a great choice for any production line.
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