Used ESEC 2008 HS #9360791 for sale

ESEC 2008 HS is an automated die attacher designed for dynamic packaging applications. It is a standalone equipment which integrates highly flexible robotics enabling an optimal orienting and attaching of any die on any substrate or package. It is designed for semiconductor processing in the automotive, medical, aerospace, and other industries. The system's architecture includes a main body, control unit, and vision unit. The main component of 2008 HS is a robotic arm that allows you to mount a die on either horizontal or vertical surfaces. This robot is capable of reaching a maximum reach of 500 mm (20 in) and provides high accuracy deposition of the die at up to 1500 cph. The control unit of the machine is an industrial-grade PC with an external industrial-grade video board. It provides near real-time communication with the robot allowing for fast and accurate data acquisition and control of the robot's motions. The video board with its own processor is capable of allowing near real-time evaluation of visual data to ensure accurate positioning and attachment of the die. The vision tool is an important part of the asset. It is built around a megapixel camera to capture images of the die and the substrate in order to provide reliable data for the exact placement of the parts to be connected. The vision model also provides a large amount of data for controlling precise and accurate die attaching. The die attaching performed by ESEC 2008 HS is extremely precise and offers high precision accuracy within 0.02 mm. At the same time, the equipment is able to handle lead frames, matrix, and die bonding applications. The precision, accuracy, and flexibility of 2008 HS make it an ideal solution for semiconductor manufacturing and other industries requiring dynamic packaging solutions. Its reliable accuracy and speed make it a very interesting option for any automated packaging application.