Used ESEC 2008 HS3 Plus #293591358 for sale

ESEC 2008 HS3 Plus Die Attacher is a high-speed automated die-bonding machine designed to occur in factory-controlled environments to bond mechanical components to FR-4 circuit boards. This attachment process is necessary for the installation of detectors, resistors, capacitors, transistors, ICs, and other surface-mounted components to a printed circuit board. It is composed of three phases - pick-up, transport, and placement - and is considered to be an advanced machine for improving production efficiency and precision in industrial automated assembly processes. The pick-up phase of ESEC 2008HS3PLUS Die Attacher begins when an arm action is fed with the desired component from a pre-loaded hopper. The arm reaches into the hopper and grips the component, then passes it to an internal transport chain which moves the component from the pick-up zone to the placement zone. At this stage, three vision systems capture the component and confirm its presence for repeat accuracy and quality assurance. The transport chain transfers the components to the right placement area with a precision of 0.001mm. During the placement phase, the die-bonding machine identifies and utilizes the correct placement tool, based on the component's orientation, size, and bond type. A second vision system further verifies that the component is correctly aligned with the right pattern before it is placed on the substrate. The machine then uses an actuator to accurately set the height of the component. Board assessment is done automatically to ensure that the board warpage, typos, and other issues are eliminated. Once the component is correctly placed on the board, a vacuum system is automatically activated and the part is securely attached. Finally, 2008 HS 3 PLUS Die Attacher undergoes a 12-point self-test to verify its accuracy and efficiency. This die-attaching machine is also ConnectCar enabled, allowing for full integration with the factory environment, and includes a maintenance tracking system and real-time monitoring for greater transparency. In addition, it has a total production capacity of 7500 components per hour, ensuring fast and efficient processing of automotive aerospace and electronic applications.