Used ESEC 2008 HS3 Plus #293617088 for sale

Manufacturer
ESEC
Model
2008 HS3 Plus
ID: 293617088
Die bonder.
ESEC 2008 HS3 Plus is a die attacher specifically designed for attachment of die to lead frames and other components. The machine is extremely versatile, allowing for attachment of dies down to sizes of 2 mil and larger, including lead, solder, ceramic, and aluminum alloys. An operator manually inserts the die onto the two needle contacts and sets the height, allowing the machine to precisely attach the die to the lead frame using an air driven piston. The main feature of the HS3 Plus is its advanced automation options, allowing for an effortless setup. The intuitive touchscreen interface makes setup and calibration a breeze, and the encoder feedback system provides users with an accurate, repeatable cycle count while confirming die and substrate locations. Controlling the machine is just as easy, with two buttons allowing the operator to adjust the height, speed, and cycle count during the process. The machine also offers advanced safety features, such as a keyed door lock that can be used to prevent unauthorized access, as well as a safety shield covering the needle contacts. All components of the machine have been built to the highest standards, ensuring maximum reliability and repeatability in any environment. There is a range of optional accessories available for customization, including a chiller system, a heated die sinking magnetic tool, and a heated platen. Overall, ESEC 2008HS3PLUS is a reliable and versatile die attacher. It is easy to use, offers a range of advanced automation options and safety features, and is suitable for attachment of dies down to sizes of 2 mil and larger. With its intuitive touchscreen interface, reliable encoder feedback system, and a range of additional features, the machine is well suited for lead-frame assembly in any environment.
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