Used ESEC 2008 HS3 Plus #293662750 for sale

ESEC 2008 HS3 Plus is a high-speed die attacher for semiconductor manufacturing, specifically designed for assembling complex packages. The device is suitable for wire bonding, micro soldering, die attaching, and other applications that require precise die assembly. ESEC 2008HS3PLUS features a compact, user-friendly design that allows for easy manipulation and a comfortable working environment in tight workspaces. The device can be integrated and programmed in a variety of ways to meet individual requirements. It provides an efficient, cost-effective equipment for die bonding applications. 2008 HS 3 PLUS is designed to ensure maximum throughput with minimal operator intervention by utilizing its four-step die bonding process. This process comprises 1) pick-up of the semiconductor, 2) die placement, 3) die bonding and 4) placement into the product package. The device is equipped with an adjustable high-speed, multi-axis motion controller that can be programmed to pick up multiple die simultaneously, ensuring high-speed pick-ups and delivery of die. The device is also designed to be able to pick up any die shape and size, and also offers adjustable wire and tacking pressure. The adjustable parameters also help to reduce the time and cost of setting up assemblies. Additionally, all the component parts of the device are protected and automated, and the complete package is very low profile to minimize heat-related problems. 2008HS3PLUS comes with an alarm system that notifies the operator when any issues arise. It also comes with a mastering unit with built-in options for speeding up the throughput of die placement and bonding. The device can also be connected to an external monitoring machine if needed. Overall, ESEC 2008 HS 3 PLUS is an advanced and efficient die attacher that offers both precision and speed. With its wide range of capabilities and built-in alarm and monitoring systems, it is an excellent choice for any semiconductor manufacturing application that requires precise, accurate die assemblies.