Used ESEC 2008 HS3 Plus #293662751 for sale

ESEC 2008 HS3 Plus die attacher is an industrial automated machine designed for use in the processes of die attaching and wire bonding. The unit is capable of providing exceptional efficiency and production speeds in a wide range of die bonding and wire bonding requirements, making it ideal for any industrial application. The main component of ESEC 2008HS3PLUS is a high-grade alloy die press with a maximum force of up to 250 kilograms. It is highly responsive to the die structures that build up on the substrate, allowing for accurate die placement and attachment. It also features an adjustable arm which can be used to adjust the vertical clearance between the substrate and die to accommodate different types of die structures. The unit is also equipped with a high-speed, fully programmable cam motion controller which enables it to perform automated, repeatable die and wire bonding operations. It is designed to utilize a wide range of die sizes from 0.020" to 0. 260" and wire sizes from 0.004" to 0.062". It can be programmed to generate pre-programmed, single-cycle or multi-cycle bonding cycles with encapsulating and staking. 2008 HS 3 PLUS also features an advanced auto-titration process control equipment which is capable of delivering superior stitch quality. This system utilizes an electronically controlled tension and pre-travel to enable precise control for a wide range of die bonding and wire bonding operations. The pressure settings of the die press can also be manually adjusted for optimum stitch quality. 2008HS3PLUS also comes with a vacuum control unit which is used to ensure optimal vacuum and temperature during die bonding and wire bonding processes. Theunit also features a temperature control machine which prevents the die from overheating. Finally, an automatic chip out tool is also provided for the die attach operation. This asset uses air pressure to remove the bonded chips out of the die. Overall, 2008 HS3 Plus is an efficient and user-friendly die attach model which can easily accommodate to a wide range of die and wire bonding requirements. It is highly recommended for any industrial application involving die attaching and wire bonding.