Used ESEC 2008 HS3 Plus #293761092 for sale

ESEC 2008 HS3 Plus is a high-performance die attach equipment manufactured by ESEC Inc. This system is designed for automated die attach applications in a variety of industries, including automotive, consumer electronics, biomedical, and aerospace. The unit is a fully automated solution that is capable of performing a wide variety of die attach operations including die-to-lead bonding, wire bonding, and encapsulation processes. ESEC 2008HS3PLUS utilizes a high-speed, linear gantry drive machine that moves a series of x, y, and z axes to precisely position components during bonding processes. The tool also includes a programmable vision asset with advanced image processing and detailed pattern recognition capabilities. This allows for precise placement and registration of components and die attach processes even at high speeds. The model also features a modular tooling design, making it customizable to a variety of device and component sizes. It is capable of handling a wide range of packaging formats, including plastic quad flatpacks, QFNs, and array substrates. The equipment is also compliant with many industry standards, including UL, Yazaki, Panasonic, and RoHS. The system is RoHS-certified to ISO 14001, ensuring that the unit is safe to use and perform die attach processes in an environmentally friendly manner. 2008 HS 3 PLUS is an extremely precise and reliable machine, capable of performing die attach operations in a wide variety of industrial environments. Its automated vision tool ensures that components and die attach processes are accurately positioned and performed. The asset is also built to strict industry standards, ensuring that it is fully compliant with safety regulations and environmental requirements. By investing in 2008HS3PLUS, customers can be sure that they are receiving an available, reliable, and powerful model that will enable them to automate their die attach applications with ease.