Used ESEC 2008 HS3 Plus #293809533 for sale

ESEC 2008 HS3 Plus Die Attacher is an automated equipment that is designed for fast, accurate, and economical die bonding. This system features a high speed processing unit and a 3-axis linear motion machine for fast and accurate placement of die onto the substrate. ESEC 2008HS3PLUS Die Attacher is based on a full digital programmable controller. This tool makes use of an open architecture design and a full color LCD screen which makes it easy to operate and allows for quickly set-up and operation. The control asset monitors and adjust the die alignment with high accuracy while also monitoring die placement force and temperature. The model also features an advanced tooling equipment that allows for a wide range of die sizes to be processed with ease. This system enables efficient and accurate placement of die with oversized or undersized die characteristics. It has an electronic counted die recognition unit which shows the number of dies loaded in the machine and also displays useful information like the die type, orientation, and others for precise alignment of die on to the substrate. The advanced die verification tool of 2008 HS 3 PLUS Die Attacher helps ensure the quality of the bond. This asset verifies the presence of gap thickness between the die and substrate, and checks for shorts, opens, and other die defects. The model can also check die height settings, size, and location to prevent misplacement of die onto the substrate. 2008HS3PLUS Die Attacher features a wide range of process parameters that can be adjusted for optimal die attachment. This equipment allows for selection and tuning of parameters like bond force, bond time, mixture time, mixture pressure, and others so that optimal performance can be achieved. Additionally, the system supports advanced functions like real-time temperature control, die selection, product changeovers, auto-checking placement, and others for improved efficiency. Overall, ESEC 2008 HS 3 PLUS Die Attacher provides a powerful, reliable, and economical solution for handling and bonding of die onto substrates. It is designed to deliver highly accurate and reliable die bonding at a fast speed so that production throughput and product quality can be optimized.