Used ESEC 2008 HS3 Plus #9100062 for sale

ESEC 2008 HS3 Plus Die Attacher is a post-heater die bonder that provides fully automated die mounting onto qualified substrates such as ceramics, flex circuits, or laminate. It is equipped with a manual assembly desk and a six-station loader that can load a total of three standard die per station. The machine makes use of a single nozzle for die attachment and a force-controlled needle for die attach that is mounted on an XY table for precisely applying and controlling adhesive. The HS3 Plus also features on-the-fly vision recognition and registration capabilities, as well as an automatic material handling equipment. This system allows for the automated loading and unloading of die onto the substrate. The HS3 Plus is designed to offer reliable and repeatable attachment of die with features such as a stainless steel embedded structure that provides a damping effect to reduce vibration. The repeatability of die placement is ensured with the machine's features such as a precision XY table, adjustable vacuum force, and adjustable nozzle with multiple tips for controlling adhesive volume. The overall repeatability of the HS3 Plus is also increased through the use of its active guidance unit that ensures precise placement and alignment of die onto the substrate. To ensure accurate die attach results, the HS3 Plus features both an automated camera and preheat machine. The camera allows for quick and orderly vision recognition and registration of die onto qualified substrates. The camera also helps to minimize misalignment issues and potential damage to die. In terms of preheat capability, the HS3 Plus includes a low-end preheat power source of up to 9 watts, to provide consistent temperatures for die attach. This power source is fully adjustable, allowing users to tailor preheat profiles as necessary for any calculated die attach process. In addition to the features it offers, the HS3 Plus is designed for flexible operation with a small footprint. This machine requires minimal floor space, and is operated with a built-in 3-inch color LCD screen featuring an intuitive user interface. All settings and adjustments can be done directly on the machine, providing users with a simple and user-friendly die attach process. ESEC 2008HS3PLUS Die Attacher is a state-of-the-art machine that provides reliable and repeatable die attach processes with quick set-up and operation. It is suitable for a variety of substrates and can be used in a wide range of industrial applications. Integrated with a preheat tool, automated guidance, and on-the-fly vision recognition capabilities, this machine can ensure accurate and precise die attach results - minimizing misalignment issues and potential damage.