Used ESEC 2008 HS3 Plus #9100684 for sale

ESEC 2008 HS3 Plus is a die attacher designed to handle both single and double string dies. It is an advanced die attach equipment that allows for the rapid and accurate positioning of component dies onto ceramic substrates while delivering excellent reliability and repeatability. It uses a three-axis pick-and-place system with an additional X-Y axis mounted to the pick-and-place head. This unit is specifically designed for high-volume productions of multiple die arrangement for larger devices. The pick-and-place head is equipped with a dual-click-fit machine, which assures that the component-die is securely placed before and during the adhesive dispensing process. ESEC 2008HS3PLUS has a fully enclosed working area for dust protection and for improved safety. It also features a vacuum tool, which ensures that component-dies are securely held in place during the moving and positioning process. The vacuum asset also greatly improves the accuracy of die placement. 2008 HS 3 PLUS has an advanced software control model that allows for quick programming of the feeding and positioning of the component dies. The equipment can store a maximum of 60 programs with a total of up to 600 component-die placements. It can also cater for external trigger input and outputs, allowing for interfacing with other systems. 2008 HS3 Plus comes with an optional integrated vision system for component recognition. The unit includes adjustable positioning parameters, a full color monitor, a high-level recognition software, and a camera. This machine can recognize and identify various die shapes and sizes, resulting in better accuracy and reliability. ESEC 2008 HS 3 PLUS is powered by a 2.5 amp brushless DC servo motor. This motor offers higher speed, better accuracy, and improved reliability compared to conventional die attachers. The maximum speed of the motor is 50 mm/sec. Overall, 2008HS3PLUS is an advanced die attach tool that is quick, accurate, and reliable. It is suitable for high-volume productions of electronic component-dies with multiple arrangements. It also includes an optional integrated vision asset for component recognition, which makes it perfect for use in precision die attach and handling applications.