Used ESEC 2008 HS3 Plus #9100685 for sale

ESEC 2008 HS3 Plus is a die attacher designed for the attachment of small and medium die sizes. It is a versatile tool for wire bonding applications with an adjustable pitch and a nominal bond area of 10-17 μm. ESEC 2008HS3PLUS supports a range of die sizes from 0.040" to 1.00" and has a maximum die bond force of 15 grams with an accuracy of ±2.5 μm. It is compatible with a wide range of die sizes, from thinned and bumped flip chip to 700 μm BGA. It has a low noise-level, allowing for use in applications that require the utmost precision. The low profile design enables the device to fit into tight spaces and its lightweight construction makes it easy to move and transport. A built-in software package is provided with the device, allowing for quick set-up and operation. This software also allows for quick diagnostics, providing accurate and detailed information. 2008 HS 3 PLUS features linear and angular adjustability up to ±7° and a total pitch range of 3-12mm. It also has a selectable bond cycle mode, allowing for accurate and dependable die attachement. You can also customize your die attacher with optional features, such as flexible cabling, adhesives, and other specialty tools. 2008 HS3 Plus is an accurate and reliable tool for die attaching and wire bonding. It is designed to provide precise control in a wide range of applications, from the most demanding of production environments to the most precise of laboratory environments. The outstanding combination of performance, precision, and reliability makes 2008HS3PLUS an ideal choice for die attaching.