Used ESEC 2008 HS3 Plus #9100690 for sale

ESEC 2008 HS3 Plus
Manufacturer
ESEC
Model
2008 HS3 Plus
ID: 9100690
Wafer Size: 8", 12"
Vintage: 2006
Die bonder, 8" & 12", 2006 vintage.
ESEC 2008 HS3 Plus is a semi-automatic die attacher. The device is used in the production of printed circuits boards and can be used to attach components to the board quickly and accurately. The device is equipped with a pneumatically controlled lifting head designed to make the attachment process more accurate and faster than manual attacher systems. The height, stroke distance, and pressure are all adjustable to accommodate a variety of components and Printed Circuit Boards (PCBs). The device can also be fitted with a variety of component setting heads, such as micro pins, screw terminals, and pins. The settings for these different heads can also be adjusted to accommodate the different components being used. The unit has a precision-controlled guide system, which allows it to accurately align components with the appropriate pads on the PCB. The guide system also includes optical scanners to confirm the correct alignment and function. This ensures that the right components are placed in the right place, ensuring the success of the production process. ESEC 2008HS3PLUS has a user-friendly control interface that allows for easy operation and programming options. The device can be programmed to repeat previous settings, so that users can set up preset production parameters quickly and accurately. The die attacher is also equipped with safety features designed to protect the operator from injury. These features, such as an emergency stop button and safety guard, help to prevent accidental activation of the machine. 2008 HS 3 PLUS is a reliable and efficient semi-automatic die attacher that can help streamline the production of printed circuits boards, ensuring the accuracy and speed of component placement.
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