Used ESEC 2008 HS3 Plus #9100691 for sale

ESEC 2008 HS3 Plus
Manufacturer
ESEC
Model
2008 HS3 Plus
ID: 9100691
Wafer Size: 8", 12"
Vintage: 2006
Die bonder, 8" & 12", 2006 vintage.
ESEC 2008 HS3 Plus is an advanced high-speed automated die-attach equipment designed for continuous production of die sizes up to 16 mm and allows attachment with minimum defects and extremely low contamination. The system delivers fast and accurate placement of die in difficult-to-reach areas. Its features include: High-Z accuracy servo motors for precise die placement and maximum reliability Comprehensive control unit for high accuracy and repeatability User-friendly touch screen display for simple programming and operation Optional function 'teach-in' for quick programming of difficult applications Customizable recipes for increased flexibility Quality assurance via integrated process control Multi-die handling for flexibility in application Robust die-holder made of high-temperature resistant ceramic material Pneumatic die-holder for highest accuracy Pressure sensor ensures optimal die placement pressure Automated vision inspection for quality assurance Manual vision inspection for detailed analysis Compatibility with standard Linux PC's for remote maintenance and upgrades ESEC 2008HS3PLUS die attacher is designed to ensure maximum performance and utmost robustness in die attach applications. The servo motors integrated in the platform allow for repeatable and dependable accuracy levels. The machine is compatible with standard Linux PCs for remote maintenance and upgrades, and customizable recipes can be easily programmed for increased flexibility. The robust die-holder, incorporating a pressure sensor which controls the pressure of die-placement, combined with the automated vision inspection function, ensures superior performance in terms of accuracy, quality assurance and reliability. The manual vision inspection allows for a detailed analysis of the attachment, ensuring that defects are quickly detected and corrected.
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