Used ESEC 2008 HS3 Plus #9100692 for sale

ESEC 2008 HS3 Plus is a state-of-the-art die attacher that is specifically designed for the US semiconductor industry. It can be used for the attachment of microcircuits at leadframes, substrates, and hybrid interconnects. It provides a high resolution die attach with low cycle times and a minimum of thermal damage. The HS3 Plus is capable of attaching die of various sizes to any substrate with a pitch range of 5 to 500 um. The HS3 Plus has a precision XY stage with a Z axis. This allows it to move with a maximum speed of 30 cm/second and is capable of 8-bit positioning resolution. It also has a three-axis non-contact vision equipment, which allows it to detect misaligned die and calculate the exact placement location of each die. The vision system compensates for any misalignment, which ensures that all die are placed accurately and with a minimum of thermal damage. Additionally, the vision unit can correct for any offset error in the die pack. The HS3 Plus can be used for CEVA, eutectic, and flip chip die attach. It also supports a variety of processes such as reflow, soldering, and die attach with epoxy or silicone. The machine is highly configurable, allowing the user to adjust parameters such as die attach force, die placement accuracy, and heated stage temperature. The HS3 Plus is equipped with a temperature controller and a plasma actuation tool. The temperature controller provides a temperature range of 10-400C and is capable of 250C in 2 seconds. The plasma actuation asset is used for the removal of unwanted or defective die and can remove die with a height of up to 4mm. It is also capable of processing substrates up to 200 cm2 in area. The HS3 Plus is a reliable and cost efficient solution for microelectronics manufacturers. It is capable of high accuracy, low cycle times and minimum thermal damage, making it an ideal choice for die attach processes.