Used ESEC 2008 HS3 Plus #9100694 for sale

ESEC 2008 HS3 Plus
Manufacturer
ESEC
Model
2008 HS3 Plus
ID: 9100694
Wafer Size: 8", 12"
Vintage: 2006
Die bonder, 8" & 12", 2006 vintage.
ESEC 2008 HS3 Plus die attacher is an automated, high speed die attach machine designed to increase efficiency and reduce production costs. The machine employs a combination of five stepper motors, advanced electronics, a robotic arm, and several other innovative components to accurately dispense small components such as dies, chips, and balls, onto printed circuit boards. The machine offers a wide range of die attach capabilities, such as internal copper bumping, laser attach, flip chip bumping, through-hole attach, and bottom attach. It is designed to work with lead frames of up to 200mm in size and with positioned accuracy of 0.02mm. The unique feature of this die attacher is that it can also be equipped with optional laser capping and ball attach capabilities. ESEC 2008HS3PLUS die attacher is equipped with an advanced vision equipment that can detect, analyze, and sort dies and components on the fly to ensure accurate placement on the board. The machine also features a high speed, three-point floating head system that can pick and place components with a maximum speed of 2,800 cycles/minute. This feature allows for fast and accurate die attach of components of varying sizes and shapes. Additionally, the machine is capable of achieving a speed of up to 6,000 cycles/minute when using only one head. The machine is also equipped with a high-resolution color LCD touch screen console, which allows for easy operation and specification selection. The touch screen enables operators to access and control various parameters on the machine's controller, such as motor speeds, die-size adjustment, and program parameter customization. The user-friendly interface further helps to increase the machine's operation efficiency. 2008 HS 3 PLUS die attacher also features a number of other advanced features, such as a dual servo motor driving unit which allows for higher accuracy, as well as an automatic component count machine that helps to ensure accurate component placement. The machine is also equipped with a number of safety measures such as a safety switch to shut the machine down in case of a malfunction or emergency. Overall, ESEC 2008 HS 3 PLUS die attacher is an innovative and highly advanced machine that offers a wide range of die attach capability. Its advanced features and user-friendly interface make it an ideal choice for high volume production environments. This machine is designed to help reduce production costs, increase efficiency, and increase the quality of the final product.
There are no reviews yet