Used ESEC 2008 HS3 Plus #9100695 for sale

ESEC 2008 HS3 Plus die attacher is a tool used by semiconductor manufacturers to attach dies (semiconductor chips) to substrates. The machine is part of the wafer-level chip-scale packaging (WL CSP) solution and supports a wide range of technology requirements, from large to small die types, as well as irregular-shaped dies and bumps. The HS3 Plus features a second high-resolution vision equipment for die, substrate and die-attachment integrity inspection. The system consists of a board assembly, die holder, laser die attach, alignment controller and x-y-z axis placement mechanisms. The board assembly and alignment Controller combine to provide precision die attach placement accuracy. The die holder and x-y-z axis mechanism allow for various die-attachment configurations and types. The HS3 Plus also provides software options for optimizing die attach process parameters, such as pressure, speed and temperature. The HS3 Plus uses a laser die attach technique to ensure a reliable and repeatable die attach process. The unit operates at high power and offers a high-quality attach surface finish, improving the overall machine yield rate. The die attach process is capable of achieving a minimum chip-to-wafer bond strength of 76gf/mm2, ensuring a reliable chip-to-package connection. In addition, the HS3 Plus provides multiple automated functions to enhance the die attach process. These functions include die-height calibration, substrate curing and die trimming. With these features, the tool is able to better maintain die attach process parameters, as well as reduce labor time and cost. The HS3 Plus provides an automated production solution for die attach needs. The asset is capable of high-volume production and is well-suited for applications in high-density microelectronic production. The model is an ideal choice for semiconductor manufacturers looking for an economical and reliable die attach equipment.